7. Create the design variables.

You will use the multiplier and substitution methods to create design variables from the boundary condition parameters that are present in the correlated solution.

  1. In the TMG Correlation dialog box, select the Design Variables > Definition node.
  2. In the Parameters and Expressions group, from the Type list, make sure that Parameters is selected.
  3. Expand the Filter subgroup, and select the Source Type check box.
  4. From the Source Type list, select Heat Load.
  5. Click Filter to only display the heat load sources in the Parameter and Expression table.
  6. From the Parameters and Expressions table, select Heat Load.
  7. In the Design Variable Definition group, from the Design Variable Method list, select Substitution to replace the Heat Load by a design variable.
  8. In the Design Variable Name box, type DV1_Heat_Load.
  9. Click Add Design Variable to add the DV1_Heat_Load design variable to the active thermal correlation analysis.
  10. In the Filter group, from the Source Type list, make sure that Contact Thermal Coupling is selected.
  11. Click Filter to only display the contact thermal coupling sources in the Parameters and Expressions table.
  12. From the Parameters and Expressions table, select Total Conductance.
  13. From the Design Variable Method list, select Multiplier to multiply the parameter by a design variable.
  14. In the Design Variable Definition group, in the Design Variable Name box, type DV2_antena_bus_TCTC_Total_Conductance.
  15. Click Add Design Variable to add the design variable to the active thermal correlation analysis.
  16. From the Parameters and Expressions table, select Heat Transfer Coefficient.
  17. In the Design Variable Definition group, in the Design Variable Name box, type DV3_walls_mass_TCTC_Heat_Transfer_Coefficient.
  18. Click Add Design Variable to add the design variable to the active thermal correlation analysis.
  19. From the Parameters and Expressions table, select the two Conductance per Length parameters.
  20. In the Design Variable Definition group, in the Design Variable Name box, type DV4_panel_bus_conductance.
  21. Click Add Design Variable to add the design variable to the active thermal correlation analysis.