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Performing a thermal correlation analysis on a steady state problem
In this tutorial, you will learn how to set up and solve a thermal correlation analysis, analyze the results, and update the model with the optimized results for a steady-state problem.
2. Examine the model.
You will explore the boundary conditions in the model to learn more about how the model is constructed.

Tutorials
- TMG Correlation tutorials
  These examples are designed to help you become familiar with some of the major features available in TMG Correlation.
- Performing a thermal correlation analysis on a steady state problem
  In this tutorial, you will learn how to set up and solve a thermal correlation analysis, analyze the results, and update the model with the optimized results for a steady-state problem.
  - 1. Open the Simulation file.
    In addition to opening the file used for this tutorial, you will reset the dialog boxes to ensure that they are in the expected initial state.
  - 2. Examine the model.
    You will explore the boundary conditions in the model to learn more about how the model is constructed.
  - 3. Create a thermal correlation analysis.
    You will create a thermal correlation analysis using TMG Correlation.
  - 4. Define the sensors.
    You will create four sensors by importing reference data from a CSV file.
  - 5. Pair the sensors with the simulation model.
    You will pair the sensors with the elements of the simulation model using the proximity method.
  - 6. Create the design variables.
    You will use the multiplier and substitution methods to create design variables from the boundary condition parameters that are present in the correlated solution.
  - 7. Set up the targets.
    You will set the weight factor of the bus targets for the optimization process.
  - 8. Define the optimization design variables.
    You will specify the minimum, and maximum values of the four design variables you previously created to limit their variation during the optimization process.
  - 9. Set up the solver settings.
    You will define the TMG Correlation solver parameters for the optimization.
  - 10. Solve the thermal correlation analysis.
    You will launch the optimization of the active thermal correlation analysis.
  - 11. Plot the thermal correlation graph during the optimization process.
    The Solution Monitor dialog box is still open from the previous step. During the solve, you will plot the evolution of the objective function and the evolution of the design variables gradient.
  - 12. Analyze the optimized solution results.
    You will load and analyze the optimized solution results after solving a thermal correlation analysis. You will compare the reference and optimized temperature values of the targets after solving the thermal correlation analysis.
  - 13. Update the simulation model.
    You will update and save the new simulation model that contains the optimized design variable values applied to the related parameters.
- Performing a thermal correlation analysis on a transient problem
  In this tutorial, you will learn how to set up and solve a thermal correlation analysis, analyze the results, and update the model with the optimized results for a transient problem.

2. Examine the model.

You will explore the boundary conditions in the model to learn more about how the model is constructed.

In the Simulation Navigator, expand the Simulation Object Container node.
Several boundary conditions have been created for you, including thermal couplings, and interface resistances.
Explore the pre-defined boundary conditions by clicking to show the corresponding boundary condition, and clicking to hide it.
The software highlights the location of the selected boundary conditions in the graphics window.
Expand the Load Container node to examine the heat loads.
Right-click the Chip1 load node and choose Edit.
In the Thermal Loads dialog box, in the Magnitude group, note that the initial value of the chip heat load is 0.6 W.
Click Cancel to close the dialog box.
Repeat steps 5 and 6 to examine the other heat loads boundary conditions.