Home
Tutorials
Performing a thermal correlation analysis on a steady state problem
In this tutorial, you will learn how to set up and solve a thermal correlation analysis, analyze the results, and update the model with the optimized results for a steady-state problem.
6. Create the design variables.
You will use the multiplier and substitution methods to create design variables from the boundary condition parameters that are present in the correlated solution.

Tutorials
- TMG Correlation tutorials
  These examples are designed to help you become familiar with some of the major features available in TMG Correlation.
- Performing a thermal correlation analysis on a steady state problem
  In this tutorial, you will learn how to set up and solve a thermal correlation analysis, analyze the results, and update the model with the optimized results for a steady-state problem.
  - 1. Open the Simulation file.
    In addition to opening the file used for this tutorial, you will reset the dialog boxes to ensure that they are in the expected initial state.
  - 2. Examine the model.
    You will explore the boundary conditions in the model to learn more about how the model is constructed.
  - 3. Create a thermal correlation analysis.
    You will create a thermal correlation analysis using TMG Correlation.
  - 4. Define the sensors.
    You will create four sensors by importing reference data from a CSV file.
  - 5. Pair the sensors with the simulation model.
    You will pair the sensors with the elements of the simulation model using the proximity method.
  - 6. Create the design variables.
    You will use the multiplier and substitution methods to create design variables from the boundary condition parameters that are present in the correlated solution.
  - 7. Set up the targets.
    You will set the weight factor of the bus targets for the optimization process.
  - 8. Define the optimization design variables.
    You will specify the minimum, and maximum values of the four design variables you previously created to limit their variation during the optimization process.
  - 9. Set up the solver settings.
    You will define the TMG Correlation solver parameters for the optimization.
  - 10. Solve the thermal correlation analysis.
    You will launch the optimization of the active thermal correlation analysis.
  - 11. Plot the thermal correlation graph during the optimization process.
    The Solution Monitor dialog box is still open from the previous step. During the solve, you will plot the evolution of the objective function and the evolution of the design variables gradient.
  - 12. Analyze the optimized solution results.
    You will load and analyze the optimized solution results after solving a thermal correlation analysis. You will compare the reference and optimized temperature values of the targets after solving the thermal correlation analysis.
  - 13. Update the simulation model.
    You will update and save the new simulation model that contains the optimized design variable values applied to the related parameters.
- Performing a thermal correlation analysis on a transient problem
  In this tutorial, you will learn how to set up and solve a thermal correlation analysis, analyze the results, and update the model with the optimized results for a transient problem.

6. Create the design variables.

You will use the multiplier and substitution methods to create design variables from the boundary condition parameters that are present in the correlated solution.

In the TMG Correlation dialog box, select the Design Variables > Definition node.
In the Parameters and Expressions group, from the Type list, make sure that Parameters is selected.
Expand the Filter subgroup, and select the Source Type check box.
From the Source Type list, make sure that Contact Thermal Coupling is selected.
Click Filter to only display the contact thermal coupling sources in the Parameters and Expressions table.
From the Parameters and Expressions table, select the Heat Transfer Coefficient parameter with the source name CPU to PCB.
In the Design Variable Definition group, from the Design Variable Method list, select Substitution to replace the heat transfer coefficient by a design variable
In the Design Variable Name box, type DV1_CPU_to_PCB_HTC.
Click Add Design Variable to add the new design variable to the active thermal correlation analysis.
In the Filter group, from the Source Type list, select Heat Load.
Click Filter to only display the heat load sources in the Parameter and Expression table.
From the Parameters and Expressions table, from the Source Name column, select Chip1 load.
From the Design Variable Method list, select Multiplier to multiply the parameter by a design variable.
In the Design Variable Definition group, in the Design Variable Name box, type DV2_Chip1_load.
Click Add Design Variable to add the new design variable to the active thermal correlation analysis.
Repeat steps 12 to 15 for Chip 2 Load and Chip 3 Load, name their respective design variables DV3_Chip2_load and DV4_Chip3_load and add them to the active thermal correlation analysis.