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Thermal Solver
Contains thermal solver related guides, such as the TMG reference manual, thermal API guide, and error message list.
Thermal solver reference
Describes the format and contents of the thermal solver's input and output files
Thermal solver modules
The following table describes the thermal solver modules that are executed during the solving process. This section also consists of additional information about some of these modules.
REFORM module information
The REFORM module transforms the conductance-capacitance model from the MODLCF file into SINDA or ESATAN formats, or the geometry model into TRASYS or NEVADA formats. The formatted models are written in the FMODLF file.
TRASYS output format
The REFORM module can transform the conductance-capacitance model to TRASYS format.

Thermal Solver
Contains thermal solver related guides, such as the TMG reference manual, thermal API guide, and error message list.
- Thermal solver guides
  Maya HTT's thermal solver is included in Simcenter 3D and in Simcenter Femap. This page contains links to thermal solver guides, which help you understand how the thermal solver works.
- Thermal solver reference
  Describes the format and contents of the thermal solver's input and output files
  - Introduction
    In most situations, a thermal model can be defined and solved directly within your CAE software. The thermal model is built using the software's interface, and the results can then be displayed and analyzed using its built-in post-processing tools.
  - Thermal solver input cards
    To access thermal solver features outside your CAE software, you must manually input instructions and data into the thermal solver’s input file also known as the data deck using any text editor.
  - Thermal solver input and output files
    The thermal solver generates several data exchange files during the solve when using supported CAE software.
  - Thermal solver modules
    The following table describes the thermal solver modules that are executed during the solving process. This section also consists of additional information about some of these modules.
    - ANS2TMG module information
      ANS2TMG translates Ansys models into thermal solver input files by merging Ansys and thermal solver data, creating necessary boundary conditions, and converting thermal elements and material properties.
    - GRAYB module information
      The GRAYB module crates the radiative conductances, the IR, solar spectrum, and gray body view factor matrices.
    - HEMIVIEW module information
      The HEMIVIEW module calculates diffuse blackbody view factors using the hemicube method, which allows computer graphics hardware to accelerate the calculations.
    - MEREL module information
      The MEREL module performers the model condensation by element merging or renumbering, automatic combination, substructuring, and model thinning.
    - NEVADA module information
      The NEVADA module converts a NEVADA input deck into an equivalent I-deas Universal file.
    - POWER module information
      The POWER module calculates IR and solar spectrum radiative heat loads from the orbital view factors, heat flux view factors, and view factors of the VUFF file.
    - REFORM module information
      The REFORM module transforms the conductance-capacitance model from the MODLCF file into SINDA or ESATAN formats, or the geometry model into TRASYS or NEVADA formats. The formatted models are written in the FMODLF file.
      - SINDA output format
        The REFORM module can transform the conductance-capacitance model to SINDA format.
      - TRASYS output format
        The REFORM module can transform the conductance-capacitance model to TRASYS format.
      - NEVADA output format
        The REFORM module can transform the conductance-capacitance model to NEVADA format.
      - ESATAN output format
        The REFORM module can transform the conductance-capacitance model to ESATAN format.
    - TMG2ANS module information
      The TMG2ANS module translates the TMG node temperature results from GTEMPF to ANSYS version 5 input files.
    - VUFAC module information
      The VUFAC module calculates view factors, orbital view factors (solar view factors, albedo view factors, Earth view factors), heat flux view factors, view factor for axisymmetric modeling with plane stress, and thermal couplings.
    - Comparison of view factor computation modules
      This page compares VFRTGPU to the HEMIVIEW and VUFAC modules.
    - Comparison between CONDN and COND modules
      The following list provides a brief comparison between the COND and CONDN conduction modules.
  - Post-processing libraries
    The thermal solver provides the following post-processing libraries for generating results files.
  - Thermal solver bibliography
    The following bibliography lists all sources used to explain how the thermal solver works.
- Thermal solver theory
  Describes the theory and methods of the thermal solver.
- Thermal solver API
  Allows you to create or add functionality to enhance the thermal solver capabilities.
- Thermal solver error message list
  Lists solver messages that the thermal solver generates to communicate issues with the model or the solve.

TRASYS output format

The REFORM module can transform the conductance-capacitance model to TRASYS format.

If Card 2a N = 2048, a TRASYS model is written in the FMODLF file. The following rules are used:

Lump mass elements are ignored.
Beam elements are transformed into TYPE = ELEM surfaces. The surface area per unit length must be specified on the PROP card. Elements may also be written as TYPE=CY surfaces by adding the following Card 9: GPARAM 7 1 1
Triangular planar elements with emissivities ≥ 0 are transformed into TYPE = POLY surfaces.
Planar quadrilateral elements with emissivities ≥ 0 are transformed into TYPE = POLY, TYPE = RECT, or TYPE = TRAP surfaces.
The default is ACTIVE = TOP. If the reverse side of an element is created with a Card 9 REVNODE and the same radiative surface properties, ACTIVE = BOTH is used. ACTIVE = OUT is used for beam elements.
Each element is assigned a TRASYS surface number, for example element 912 may be written as SURFN = 2. The association between 912 and surface number 2 is made at the end of the deck by an entry into the CORRESPONDENCE DATA block, for example 912 = 2.

In order to avoid surface number conflicts, surface numbers are assigned sequentially in increments of 4 for TYPE = POLY surfaces. This is because internally TRASYS splits each ACTIVE = TOP quadrilateral POLY type surfaces into two and ACTIVE = BOTH into four sequentially numbered surfaces, making it necessary to leave space for the additional surface numbers.

In your CAE software you can create DISK, CONE, CYL, SPHERO, PARAB TRASYS surface types. To do this, generate a mapped mesh using higher order elements on a disk, cone, cylinder, spheroid, or paraboloid. Make the mesh including the midside nodes line up with the latitudes and longitudes, otherwise the elements will be transformed into TYPE = POLY or other errors can result.

The orientation of the surfaces follows the standard TMG convention, if the nodes are specified in a counterclockwise order, the element faces the viewer.