SINDA output format

Tittle data block

The Card 1 Title Data is entered here.

Node data block

Zero-capacitance elements become arithmetic nodes with a capacitance value equal to -1.0.

Some versions of SINDA require that at least one diffusion node, element with a non-zero capacitance,, to be present. Therefore, if only arithmetic nodes are present, TMG makes the first arithmetic node into a diffusion node with a capacitance value of 1.0^-10.

The group name of the element is entered on the comment field with a $ sign.

If Card 8 element elimination or Card 9 PARAM SUBSTR substructuring is performed, only the reduced model is written into the NODE DATA BLOCK. The information to recover the temperatures of the eliminated elements is not transmitted by TMG to SINDA.

If elements are merged with Card 7, the merged element numbers are written in the NODE DATA BLOCK, and their temperatures are recovered.

You can model temperature-dependent specific heats by specifying the table number on the MAT card and running the COND module. The elements will be flagged with as SIV. Table data will be translated into array data, with the array number set to the table number.

Initial temperature values default to 0, unless they are defined on Card 9 TINIT, or are present in the TEMPF file.

Card 9 SINK elements are translated into boundary nodes.

Conductor data block

Conductors are numbered sequentially starting with the Card 2a IST parameter value.

Radiative conductors are multiplied by the Card 2a SIGMA value.

You can model temperature-dependent thermal conductivities by entering the thermal conductivity table number on the Card 9 MAT, and running the COND module. Temperature-dependent conductors will then be flagged as SIV. The thermal conductivity data is translated into array data, with the array number set to the Card 9 table number.

TMG translates Card 6e thermal couplings into convective conductors. These are flagged as convective conductors in the comment field, and a convective conductance number array is created in the ARRAY DATA BLOCK.

Temperature-dependent thermal couplings are translated into SIV type conductors and the tables are transformed into arrays.

You can model fluid flow with Card 9 XCOND 1WAYC.

Source data block

Constant elemental heat inputs are entered here. You can create constant heat inputs with:

• Card 9 QNODE, with T2 = CONSTANT.
• Specifying the TIME parameter on a Card 6 to be CONSTANT.

Array data block

This block contains the following data:

• Temperature-dependent thermal conductivities and specific heats from Card 9 MAT.
• Temperature-dependent thermal couplings.
• Temperature-dependent heat loads defined on Card 9 INTERP, TABDATA, and TABTYPE.
• Time-dependent elemental heat load arrays for TIME ≥ 0 specified on Card 9 QNODE, INTERP, TABDATA, and TABTYPE, or calculated from geometry, for example orbital heat loads.
• Time-dependent boundary element temperatures from Card 9 SINK or Card 9 INTERP, TABDATA, and TABTYPE.
• Group names.

Variables 1 data block

This block contains CALL DA11MC statements referencing time-dependent heat loads and boundary node temperatures.

Constant heat loads specified on.

If element N1 is defined as following the temperature of N2 on a Card 9 XCOND FOLLOWER, or if the PARAM NOMRECOV option is not used and element merging is performed, which creates XCOND FOLLOWER cards in the MODLCF file, this is translated as TN1 = TN2.

Constants, execution, variables 2, output data block

Default or blank parameters are entered into these data blocks.

TMG cards not used by REFORM

The REFORM module ignores the following cards when creating a SINDA deck:

• Card 2b
• Card 5 hydraulic elements
• Card 9 HYDENV
• Card 9 MCV
• Card 9 PHASE phase change element cards
• Card 9 INTERP, TABDATA, and TABTYPE, except as previously outlined
• Card 9 PRINT
• Card 9 THERMST thermostat definitions
• Card 9 PARAM NLOOP, ACCEL, QUARTIC, ENGBAL, ALPHA, NOBUOY, NOMRECOV, PDMAX, TDIFS
• Card 9 XCOND FREE and Card 6e FREE
• Card 9 XCOND with T3 > 15 or T3 < 15