July 2026 critical fixes

Bug 122551: Thermal coupling fails for PCB components with pads when the pads are not located underneath the component

Fixed versions: 2606.2 and 2512.8

A defect was identified in the thermal coupling generated between the component case and the pads for PCB components with pads. When one or more pads were not positioned directly beneath the component, the thermal coupling was not created correctly. As a result, heat transfer between the component and its pads could be modeled incorrectly, affecting all relevant simulation results, including component and board temperatures. This issue has been corrected, and the thermal coupling is now generated correctly regardless of pad placement.

Bug 126375: Improve thermal void wall temperature computation to use area-weighted averaging for co-simulation interface convective loads in finite element models

The calculation of the thermal void wall temperature for co-simulation convective loads of type thermal void has been improved for models that use the finite element method. The wall temperature is now computed using an area-weighted average of the contributing elements. This improves accuracy, particularly for non-uniform meshes.

Bug 127366: Discrepancy in nodal convection coefficient results between tmgver2512 and tmgver2606 when using the FE post-processing library (POSTLIB) for models with edge-to-edge gluing of type conductance per length

Fixed versions: 2512.8

A bug in the FE post-processing library (POSTLIB) caused incorrect nodal convection coefficients to be reported for models using edge-to-edge gluing of type conductance per length. Earlier versions of TMG 2512 could produce nodal convection coefficient values that differed from those reported by newer TMG versions for this specific boundary condition. The issue is limited to the reported nodal convection coefficient values and does not affect the thermal solution, including temperatures, heat fluxes, or any other results. This issue has been corrected, and the reported nodal convection coefficient results are now consistent across all supported TMG versions.

Bug 127861: Emissivity override sets are not respected on plane stress elements when the Monte Carlo calculation method is used for radiation requests

Fixed versions: 2606.3, 2512.10, and 2506.13

When an emissivity override set was applied to the free or internal edge of a plane stress element, the updated emissivity was not correctly applied when using the Monte Carlo radiation calculation method. In such cases, the VUFF file reported the emissivity originally assigned to the plane stress element when the mesh was created, rather than the overridden value. As a result, the computed temperature results were incorrect. This issue has been corrected.

Bug 128098: Apparent temperature result calculation in the thermal solver does not match the definition provided in the online help documentation

The elemental apparent temperature result was incorrectly reporting the raw Oppenheim node temperature, effectively assuming a blackbody emissivity of 1.0 regardless of the element's actual emissivity.

The thermal solver now computes the element apparent temperature as:

T_apparent = ε^0.25 (T_opp + T_abs) − T_abs

where ε is its emissivity, T_opp is its Oppenheim element's temperature, and T_abs is the absolute temperature offset in the appropriate units, in accordance with the product online help documentation.

As a result, elements with zero emissivity now correctly report an apparent temperature of zero.

Bug 128152: Incorrect coating-side assignment on the shared edge between plane stress elements and other 2D elements when the plane stress thickness is defined by the physical property table, where the coating should be assigned to the side with the greater thickness

Fixed versions: 2606.3

A defect in the pre-processor module of the thermal solver affected the assignment of the coating side on shared edges between plane stress elements and other 2D elements. When the thickness of the plane stress elements was defined using the physical property table option, the coating side was not always assigned to the element with the greater thickness, as intended. This issue has been corrected. As a result, models affected by this defect may exhibit changes in computed thicknesses, heat fluxes, convection coefficients, temperatures, and other solution results.